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[IEEE InterSociety Conference on Thermal Phenomena in Electronic Systems - Las Vegas, NV, USA (23-25 May 1990)] InterSociety Conference on Thermal Phenomena in Electronic Systems - Thermally induced IC package cracking

✍ Scribed by Suhl, D.

Book ID: 126731393
Publisher: IEEE
Year: 1990
Weight: 828 KB
Category: Article
DOI: 10.1109/ITHERM.1990.113310

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