✦ LIBER ✦

Thermosonic bonding of gold wire onto silver bonding layer on the bond pads of chips with copper interconnects

✍ Scribed by Cheng-Li Chuang; Jong-Ning Aoh

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Investigation of Thermosonic Wire Bondin

✍ Yeau-Ren Jeng; Sang-Mao Chiu; Pay-Yau Huang; Shiuh-Hwa Shyu 📂 Article 📅 2010 🏛 IEEE 🌐 English ⚖ 223 KB

Thermosonic bonding of gold wire onto a

✍ Jong-Ning Aoh; Cheng-Li Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 501 KB

Development of a thermosonic wire-bondin

✍ Jong-Ning Aoh; Cheng-Li Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 506 KB

Gold Stud Bumps Flip-Chip Bonded onto Co

✍ Cheng-Li Chuang; Jong-Ning Aoh; Qing-An Liao; Chun-Chieh Hsu; Shi-Jie Liao; Guo- 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 625 KB

Oxidation of copper pads and its influen

✍ Cheng-Li Chuang; Jong-Ning Aoh; Rong-Fong Din 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 462 KB

Increasing the bonding strength of chips

✍ Cheng-Li Chuang; Qing-An Liao; Hsun-Tien Li; Shi-Jie Liao; Guo-Shing Huang 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 760 KB