Gold Stud Bumps Flip-Chip Bonded onto Copper Electrodes with Titanium and Silver Layers

✍ Scribed by Cheng-Li Chuang; Jong-Ning Aoh; Qing-An Liao; Chun-Chieh Hsu; Shi-Jie Liao; Guo-Shing Huang

• Book ID: 107455238
• Publisher: Springer US
• Year: 2008
• Tongue: English
• Weight: 625 KB
• Volume: 37
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-008-0510-8