✦ LIBER ✦
Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process
✍ Scribed by Cheng-Li Chuang; Jong-Ning Aoh; Rong-Fong Din
- Book ID
- 108210547
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 462 KB
- Volume
- 46
- Category
- Article
- ISSN
- 0026-2714
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