Thermosonic bonding of gold wire onto a copper pad with titanium thin-film deposition

✍ Scribed by Jong-Ning Aoh; Cheng-Li Chuang

• Book ID: 107453187
• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 501 KB
• Volume: 33
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-004-0135-5