Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding

✍ Scribed by Jong-Ning Aoh; Cheng-Li Chuang

• Book ID: 107453188
• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 506 KB
• Volume: 33
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-004-0136-4