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Thermal reliability analysis and optimization of polymer insulating through-silicon-vias (TSVs) for 3D integration

✍ Scribed by Zhong, ShunAn; Wang, ShiWei; Chen, QianWen; Ding, YingTao

Book ID: 125372004
Publisher: SP Science China Press
Year: 2013
Tongue: English
Weight: 812 KB
Volume: 57
Category: Article
ISSN: 1006-9321
DOI: 10.1007/s11431-013-5409-9

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