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The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints

✍ Scribed by J. Sigelko; S. Choi; K. N. Subramanian; J. P. Lucas

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effects of intermetallic morphology at t

✍ H. Rhee; F. Guo; J. G. Lee; K. C. Chen; K. N. Subramanian 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 684 KB

Effects of solid-state annealing on the

✍ Kithva H. Prakash; Thirumany Sritharan 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 850 KB

Effect of bismuth on the growth kinetics

✍ Joo-Youl Huh; Sang-Uk Han; Chang-Yong Park 📂 Article 📅 2004 🏛 TechnoPress 🌐 English ⚖ 850 KB

Characterization of the growth of interm

✍ S. Choi; T. R. Bieler; J. P. Lucas; K. N. Subramanian 📂 Article 📅 1999 🏛 Springer US 🌐 English ⚖ 291 KB

The effect of cooling rate on the dendri

✍ Leonardo R. Garcia; Wislei R. Osório; Amauri Garcia 📂 Article 📅 2011 🏛 Elsevier Science ⚖ 863 KB

Effect of Amount of Cu on the Intermetal

✍ M. E. Alam; S. M. L. Nai; M. Gupta 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 940 KB