✦ LIBER ✦

Effects of solid-state annealing on the interfacial intermetallics between tin-lead solders and copper

✍ Scribed by Kithva H. Prakash; Thirumany Sritharan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

The effect of small additions of copper

✍ J. Sigelko; S. Choi; K. N. Subramanian; J. P. Lucas 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 203 KB

Effect of the soldering time on the form

✍ Jing Bo Wan; Yong Chang Liu; Chen Wei; Peng Jiang; Zhi Ming Gao 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 919 KB

Effect of Stress State on Growth of Inte

✍ S.L. Ngoh; W. Zhou; J.H.L. Pang 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 740 KB