✦ LIBER ✦

Effect of bismuth on the growth kinetics of intermetallic compounds in Sn-3.5Ag solder joints: A growth kinetic model

✍ Scribed by Joo-Youl Huh; Sang-Uk Han; Chang-Yong Park

Publisher: TechnoPress
Year: 2004
Tongue: English
Weight: 850 KB
Volume: 10
Category: Article
ISSN: 1598-9623
DOI: 10.1007/bf03027315

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Suppressing the growth of interfacial Cu

Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

✍ Wei-Yu Chen; Chi-Yang Yu; Jenq-Gong Duh 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 798 KB

The morphology and kinetic evolution of

The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3composite solder/Cu interface during soldering reaction

✍ S. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 960 KB

The effects of temperature gradient and

The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn–3.5Ag eutectic solder

✍ Mevlüt Şahin; Emin Çadirli 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 781 KB

Effect of wall growth on the kinetic mod

Effect of wall growth on the kinetic modeling of nitrite oxidation in a CSTR

✍ Spiros N. Dokianakis; Michael Kornaros; Gerasimos Lyberatos 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 188 KB 👁 2 views

A simple kinetic model was developed for describing nitrite oxidation by autotrophic aerobic nitrifiers in a continuous stirred tank reactor (CSTR), in which mixed (suspended and attached) growth conditions prevail. The CSTR system was operated under conditions of constant nitrite feed concentration