✦ LIBER ✦

The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3composite solder/Cu interface during soldering reaction

✍ Scribed by S. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen

No coin nor oath required. For personal study only.

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