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The effect of the addition of in on the reaction and mechanical properties of Sn−1.0Ag−0.5Cu solder alloy

✍ Scribed by A-Mi Yu; Chang-Woo Lee; Mok-Soon Kim; Jong-Hyun Lee

Publisher
TechnoPress
Year
2007
Tongue
English
Weight
402 KB
Volume
13
Category
Article
ISSN
1598-9623

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## Abstract Corrosion properties of three different Sn‐Ag lead free solder alloys have been investigated in 0.3 wt% Na~2~SO~4~ solution as corrosive environment. As cast solder alloy was analyzed by X‐ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag~3~Sn in t