Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages

✍ Scribed by Asit Kumar Gain; Y.C. Chan; Ahmed Sharif; Winco K.C. Yung

• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 1011 KB
• Volume: 86
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2009.04.015