Interfacial reactions of Sn–Cu solder with Ni/Au surface finish on Cu pad during reflow and aging in ball grid array packages

✍ Scribed by M.N. Islam; Y.C. Chan

• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 503 KB
• Volume: 117
• Category: Article
• ISSN: 0921-5107
• DOI: 10.1016/j.mseb.2004.11.027