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Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder

✍ Scribed by L.C. Tsao; S.Y. Chang

No coin nor oath required. For personal study only.

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Effect of small Sn–3.5Ag–0.5Cu additions

✍ Asit Kumar Gain; Y.C. Chan; Ahmed Sharif; Winco K.C. Yung 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 1011 KB