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Strengthening mechanism of nano-Al2O3particles reinforced Sn3.5Ag0.5Cu lead-free solder

✍ Scribed by T. H. Chuang; M. W. Wu; S. Y. Chang; S. F. Ping; L. C. Tsao

Publisher: Springer US
Year: 2010
Tongue: English
Weight: 533 KB
Volume: 22
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-010-0253-1

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