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Effects of intermetallic morphology at the metallic particle/solder interface on mechanical properties of Sn-Ag-based solder joints

✍ Scribed by H. Rhee; F. Guo; J. G. Lee; K. C. Chen; K. N. Subramanian

Publisher
Springer US
Year
2003
Tongue
English
Weight
684 KB
Volume
32
Category
Article
ISSN
0361-5235

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## Abstract Corrosion properties of three different Sn‐Ag lead free solder alloys have been investigated in 0.3 wt% Na~2~SO~4~ solution as corrosive environment. As cast solder alloy was analyzed by X‐ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag~3~Sn in t