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The effect of cooling rate on the dendritic spacing and morphology of Ag3Sn intermetallic particles of a SnAg solder alloy

✍ Scribed by Leonardo R. Garcia; Wislei R. Osório; Amauri Garcia


Publisher
Elsevier Science
Year
2011
Weight
863 KB
Volume
32
Category
Article
ISSN
0261-3069

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On the effect of additions of Cu and Mg
✍ Anne Lise Dons; Gustav Heiberg; Jorunn Voje; Jorunn Snøan Mæland; Jan Ove Løland 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 507 KB

Al-7-11%Si alloys with and without Mg and Cu have been cast in the laboratory, examined metallographically and tested mechanically, before and after heat treatments. Additions of Mg and Cu increased the strength and reduced the ductility. Several mechanisms for this are discussed.