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Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

✍ Scribed by S. Choi; T. R. Bieler; J. P. Lucas; K. N. Subramanian

No coin nor oath required. For personal study only.

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