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Influence of initial morphology and thickness of Cu6Sn5and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints

✍ Scribed by X. Deng; G. Piotrowski; J. J. Williams; N. Chawla

Publisher: Springer US
Year: 2003
Tongue: English
Weight: 247 KB
Volume: 32
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-003-0108-0

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