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Thermal Oxidation Study on Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

✍ Scribed by S. Wan Cho; K. Han; Y. Yi; S. J. Kang; K.-H. Yoo; K. Jeong; C.-N. Whang

Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
188 KB
Volume
8
Category
Article
ISSN
1438-1656

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✦ Synopsis

At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We report the surface oxidation mechanism of Pb‐free solder in this paper. This mechanism has been investigated after using X‐ray photoelectron spectroscopy.

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