Application of lead-free eutectic SnAg solder in no-clean thick film electronic modules : Dongkai Shangguan, Achyuta Achari and Wells Green. IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part B, 17, 4, 603 (November 1994)

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 111 KB
• Volume: 36
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(96)81993-7