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Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

✍ Scribed by Moon Gi Cho; Sung K. Kang; Da-Yuan Shih; Hyuck Mo Lee

Publisher
Springer US
Year
2007
Tongue
English
Weight
706 KB
Volume
36
Category
Article
ISSN
0361-5235

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