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The chemical vapor deposition of copper and copper alloys

✍ Scribed by Pascal Doppelt; Thomas H. Baum


Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
337 KB
Volume
270
Category
Article
ISSN
0040-6090

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πŸ“œ SIMILAR VOLUMES


Dependence of deposition characteristics
✍ Akiko Kobayashi; Atsushi Sekiguchi; Kei Ikeda; Osamu Okada; Tomoaki Koide πŸ“‚ Article πŸ“… 2000 πŸ› John Wiley and Sons 🌐 English βš– 531 KB

When copper interconnection is applied in practical ULSI devices, it is required to fill holes and trenches with high aspect ratios with copper. A high deposition rate of 100 nm/min as well as complete gap filling at an aspect ratio of 3 was obtained in deposition of copper by chemical vapor deposit