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Selective chemical vapor deposition of copper using (hfac) copper(I) vinyltrimethylsilane in the absence and presence of water

✍ Scribed by A. Jain; A.V. Gelatos; T.T. Kodas; M.J. Hampden-Smith; R. Marsh; C.J. Mogab

Publisher: Elsevier Science
Year: 1995
Tongue: English
Weight: 988 KB
Volume: 262
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(94)05809-1

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