A simplified method of creating multilevel imprint molds with sub-100 nm dimensions has been developed. The silicon nitride (Si x N y ) molds are patterned in a negative tone resist using single write electron beam lithography process, where the feature height is controlled by the exposure dosage. T
Sub-100 nm structures by neutral atom lithography
โ Scribed by Th. Schulze; B. Brezger; P.O. Schmidt; R. Mertens; A.S. Bell; T. Pfau; J. Mlynek
- Publisher
- Elsevier Science
- Year
- 1999
- Tongue
- English
- Weight
- 1019 KB
- Volume
- 46
- Category
- Article
- ISSN
- 0167-9317
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โฆ Synopsis
Instead of using a solid mask to pattern a light beam (optical lithography) we used a mask made of light to pattern a beam of neutral atoms (atom lithography). By making use of two special features of the atom-light interaction we wrote structures with periods below A/2. In the first approach we inverted the focussing potentials by switching the detuning of the light field during the deposition. The second method uses the fact that atoms with a magnetic substructure in the electronic ground state are strongly sensitive to the polarization of the light field. Both techniques produce sub-100 nm chromium structures in one and two dimensions on silicon substrates.
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