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Nanoimprint lithography of sub-100 nm 3D structures

✍ Scribed by M. Konijn; M.M. Alkaisi; R.J. Blaikie

Publisher: Elsevier Science
Year: 2005
Tongue: English
Weight: 297 KB
Volume: 78-79
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2004.12.081

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✦ Synopsis

A simplified method of creating multilevel imprint molds with sub-100 nm dimensions has been developed. The silicon nitride (Si x N y ) molds are patterned in a negative tone resist using single write electron beam lithography process, where the feature height is controlled by the exposure dosage. These patterns are then transferred into the substrate by a single reactive ion etch. By defining multilevel structures in a single write, a number of alignment steps are eliminated when fabricating 3D structures. The patterns were very well reproduced when imprinted in poly(methyl-methacrylate) at low temperatures, with no observed damage to the mold.

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