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Shallow and deep dry etching of silicon using ICP cryogenic reactive ion etching process

✍ Scribed by Ü. Sökmen; A. Stranz; S. Fündling; S. Merzsch; R. Neumann; H.-H. Wehmann; E. Peiner; A. Waag

Publisher
Springer-Verlag
Year
2010
Tongue
English
Weight
969 KB
Volume
16
Category
Article
ISSN
0946-7076

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