Selective etching of silicon in aqueous KOH
โ Scribed by Lai-Cheng Chen; Minjan Chen; Chi-Chao Wan; Tay-Her Tsaur; Chenhsin Lien
- Publisher
- Elsevier Science
- Year
- 1995
- Tongue
- English
- Weight
- 1024 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0921-5107
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โฆ Synopsis
The polarization curves of p-type and n-type silicon in aqueous KOH were studied. It is indicated that both p-Si and n-Si exhibit active-passive transpassive behaviour. The difference in polarization curve between these two types of Si is attributed to the carriers' transport limitation. In the p-Si, the electrons are limited, and the cathodic current is consequently restricted. On the contrary, the holes are limited for the n-Si, and hence the anodic current as well as passive film formation are restricted. This carrier transport limitation model for silicon is quite different from the model for the metals that demonstrate a passivity effect. Since the passivation potential and open-circuit potential are different for p-Si and n-Si in aqueous KOH. selective anisotropic etching can be achieved by applying a proper external potential. Both depressed and protruding cross-patterned n-type zones on a p-type substrate have been fabricated by applying a proper potential to the p n junction.
๐ SIMILAR VOLUMES
Anisotropic chemical etching of monocrystalline silicon in KOH aqueous solution is investigated. The atomic scale model proposed is based on the influence of the OH group on chemical bonds. Etch rate and activation energies are calculated and extended to the complete etch rate polar diagram and comp
## High -index silicon planes have been etched with KOH of concentrations ranging from 2 mol/l to 12 mol/l (lo-46 wt.%) at temperatures between 50 "C and 95 "C, using two kinds of samples. We have etched mechanically prepared {n 11) and {nnl) (n = 2, 3, 4) crystal planes which we obtained by bevel