๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

KOH etching of high-index crystal planes in silicon

โœ Scribed by E. Herr; H. Baltes


Publisher
Elsevier Science
Year
1992
Tongue
English
Weight
978 KB
Volume
31
Category
Article
ISSN
0924-4247

No coin nor oath required. For personal study only.

โœฆ Synopsis


High

-index silicon planes have been etched with KOH of concentrations ranging from 2 mol/l to 12 mol/l (lo-46 wt.%) at temperatures between 50 "C and 95 "C, using two kinds of samples. We have etched mechanically prepared {n 11) and {nnl) (n = 2, 3, 4) crystal planes which we obtained by bevelling silicon samples at accurately adjusted angles. Furthermore, we etched samples that were cut out of industrially fabricated (211) wafers. The results for the two kinds of (211) samples are found to agree for crystal planes that keep their orientation during etching. Non-reproducible etch rates are obtained, however, for those high-index etch fronts that disintegrate into facets of dissimilar crystal orientations.


๐Ÿ“œ SIMILAR VOLUMES


Selective etching of silicon in aqueous
โœ Lai-Cheng Chen; Minjan Chen; Chi-Chao Wan; Tay-Her Tsaur; Chenhsin Lien ๐Ÿ“‚ Article ๐Ÿ“… 1995 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 1024 KB

The polarization curves of p-type and n-type silicon in aqueous KOH were studied. It is indicated that both p-Si and n-Si exhibit active-passive transpassive behaviour. The difference in polarization curve between these two types of Si is attributed to the carriers' transport limitation. In the p-Si

New trends in atomic scale simulation of
โœ H. Camon; Z. Moktadir; M. Djafari-Rouhani ๐Ÿ“‚ Article ๐Ÿ“… 1996 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 384 KB

A new atomic scale model has been developed to simulate anisotropic etching of silicon in KOH solutions. This model is based on the influence of the number of hydroxide groups attached to atoms. Etch rates and macroscopic activation energies have been calculated and compared with experimental data.

RIE lag in high aspect ratio trench etch
โœ Henri Jansen; Meint de Boer; Remco Wiegerink; Niels Tas; Edwin Smulders; Christi ๐Ÿ“‚ Article ๐Ÿ“… 1997 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 552 KB

While etching high aspect ratio trenches into silicon with reactive ion etching (POE) using an SFJO2 chemistry it is observed that the etch rate is depending on the mask opening. This effect is known as POE lag and is caused by the depletion of etching ions and radicals or inhibiting neutrals during

Anisotropic wet etching silicon tips of
โœ Jianqiang Han; Shaoyong Lu; Qing Li; Xiaolu Li; Jiangying Wang ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 667 KB

Etching silicon tips in potassium hydroxide (KOH) solution has the advantages of simplicity, easy to handle, low-cost and homogeneous etching rate of the (1 0 0) crystal plane. But the opening angle of silicon tips etched in pure KOH solution or KOH solution saturated with isopropyl alcohol (IPA) ad