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RIE etching of deep trenches in Si using CBrF3 and SF6 plasma

✍ Scribed by A.M. Krings; K. Eden; H. Beneking

Book ID: 107920355
Publisher: Elsevier Science
Year: 1987
Tongue: English
Weight: 303 KB
Volume: 6
Category: Article
ISSN: 0167-9317
DOI: 10.1016/0167-9317(87)90087-6

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