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Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer

✍ Scribed by Wu, Yi-Hsin; Yu, Chi-Yang; Ho, Cheng-Ying; Duh, Jenq-Gong

No coin nor oath required. For personal study only.

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