✦ LIBER ✦

Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn–Ag–Cu/Ni solder joints

✍ Scribed by Shao-Wei Fu; Chi-Yang Yu; Tae-Kyu Lee; Kuo-Chuan Liu; Jenq-Gong Duh

No coin nor oath required. For personal study only.

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