✦ LIBER ✦

Characterization of ternary Ni2SnP layer in Sn–3.5Ag–0.7Cu/electroless Ni (P) solder joint

✍ Scribed by Han-Byul Kang; Jee-Hwan Bae; Jeong-Won Yoon; Seung-Boo Jung; Jongwoo Park; Cheol-Woong Yang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Control of interfacial reaction layers f

✍ Han-Byul Kang; Jee-Hwan Bae; Jae-Wook Lee; Min-Ho Park; Young-Chul Lee; Jeong-Wo 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 341 KB

Microstructure of interfacial reaction l

✍ Han-Byul Kang; Jee-Hwan Bae; Jeong-Won Yoon; Seung-Boo Jung; Jongwoo Park; Cheol 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 388 KB

Inhomogeneous Consumption of the Electro

✍ Yong-Jun Oh; Sung-Yong Oh 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 744 KB

In situ TEM characterization of interfac

✍ Han-Byul Kang; Jee-Hwan Bae; Jeong-Won Yoon; Seung-Boo Jung; Jongwoo Park; Cheol 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 439 KB

Characterization of Cu3P phase in Sn3.0A

✍ Chen, Jian-xun; Zhao, Xing-ke; Zou, Xu-chen; Huang, Ji-hua; Hu, Hai-chun; Luo, H 📂 Article 📅 2014 🏛 Springer-Verlag 🌐 English ⚖ 673 KB

Characterization of Interfacial Reaction

✍ Han-Byul Kang; Jee-Hwan Bae; Jae-Wook Lee; Min-Ho Park; Jeong-Won Yoon; Seung-Bo 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 373 KB