Control of interfacial reaction layers formed in Sn–3.5Ag–0.7Cu/electroless Ni–P solder joints

✍ Scribed by Han-Byul Kang; Jee-Hwan Bae; Jae-Wook Lee; Min-Ho Park; Young-Chul Lee; Jeong-Won Yoon; Seung-Boo Jung; Cheol-Woong Yang

• Book ID: 113897618
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 341 KB
• Volume: 60
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2008.10.017