Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints

✍ Scribed by Yung-Chi Lin; Kai-Jheng Wang; Jenq-Gong Duh

• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 898 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-009-1014-x