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Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint

✍ Scribed by H.W. Tseng; C.Y. Liu

Book ID: 113792195
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 737 KB
Volume: 62
Category: Article
ISSN: 0167-577X
DOI: 10.1016/j.matlet.2008.05.029

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