𝔖 Bobbio Scriptorium
✦   LIBER   ✦

The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder

✍ Scribed by Huann-Wu Chiang; Kenndy Chang; Jun-Yuan Chen

Publisher
Springer US
Year
2006
Tongue
English
Weight
384 KB
Volume
35
Category
Article
ISSN
0361-5235

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Thermal Oxidation Study on Lead-free Sol
Thermal Oxidation Study on Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge
✍ S. Wan Cho; K. Han; Y. Yi; S. J. Kang; K.-H. Yoo; K. Jeong; C.-N. Whang πŸ“‚ Article πŸ“… 2006 πŸ› John Wiley and Sons 🌐 English βš– 188 KB

At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We