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The effects of third alloying elements on the bulk Ag3Sn formation in slowly cooled Sn–3.5Ag lead-free solder

✍ Scribed by Jun Shen; Shiqiang Lai; Yongchang Liu; Houxiu Gao; Jun Wei

Publisher
Springer US
Year
2007
Tongue
English
Weight
381 KB
Volume
19
Category
Article
ISSN
0957-4522

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