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Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints

✍ Scribed by Wenxing Dong; Yaowu Shi; Yongping Lei; Zhidong Xia; Fu Guo

Publisher: Springer US
Year: 2009
Tongue: English
Weight: 607 KB
Volume: 38
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-009-0839-7

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