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Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

✍ Scribed by Y.D. Han; H.Y. Jing; S.M.L. Nai; L.Y. Xu; C.M. Tan; J. Wei

Publisher: Springer US
Year: 2009
Tongue: English
Weight: 448 KB
Volume: 39
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-009-0970-5

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