✦ LIBER ✦

Creep behavior of eutectic Sn-Cu lead-free solder alloy

✍ Scribed by C. M. L. Wu; M. L. Huang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Creep behavior of eutectic Sn-Cu lead-fr

✍ C. M. L. Wu; M. L. Huang 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 338 KB

Impression creep behavior of lead-free S

✍ R. Mahmudi; A.R. Geranmayeh; A. Rezaee-Bazzaz 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 802 KB

Creep Behavior of Lead-Free Sn-Ag-Cu

✍ N. Hidaka; H. Watanabe; M. Yoshiba 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 826 KB

Creep and rupture behavior of Cu wire/le

✍ Kepeng Wu; Makoto Aoyama; Noboru Wade; Jie Cui; Shinji Yamada; Kazuya Miyahara 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 209 KB

Indentation creep study of lead-free Sn–

✍ R. Mahmudi; A.R. Geranmayeh; M. Bakherad; M. Allami 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 974 KB

Room-temperature indentation creep of le

✍ R. Mahmudi; A. R. Geranmayeh; S. R. Mahmoodi; A. Khalatbari 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 583 KB