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Room-temperature indentation creep of lead-free Sn–Bi solder alloys

✍ Scribed by R. Mahmudi; A. R. Geranmayeh; S. R. Mahmoodi; A. Khalatbari

Publisher
Springer US
Year
2007
Tongue
English
Weight
583 KB
Volume
18
Category
Article
ISSN
0957-4522

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Effect of cooling rate on the room-tempe
Effect of cooling rate on the room-temperature indentation creep of cast lead-free Sn-Bi solder alloys
✍ Mahmudi, R. ;Geranmayeh, A. R. ;Mahmoodi, S. R. ;Khalatbari, A. 📂 Article 📅 2007 🏛 John Wiley and Sons 🌐 English ⚖ 418 KB

## Abstract The influence of cooling rate on the creep behavior of cast Sn–(1–5)%Bi solder alloys was studied by indentation testing at room temperature. The alloys were prepared at two different cooling rates of 0.01 Ks^–1^ and 8 Ks^–1^. This affected the microstructure and thus, the creep behavio