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Indentation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solder alloys

✍ Scribed by R. Mahmudi; A.R. Geranmayeh; H. Khanbareh; N. Jahangiri

Publisher
Elsevier Science
Year
2009
Weight
551 KB
Volume
30
Category
Article
ISSN
0261-3069

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✍ R. M. Shalaby 📂 Article 📅 2010 🏛 John Wiley and Sons 🌐 English ⚖ 145 KB 👁 1 views

## Abstract The Sn‐Zn alloys have been considered as lead‐free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and micro‐creep of the Sn‐9Zn lead‐free solders were investigated. It is shown that the a