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Solidification behavior of Sn–9Zn–xAg lead-free solder alloys

✍ Scribed by Ying-Ling Tsai; Weng-Sing Hwang

Publisher: Elsevier Science
Year: 2005
Tongue: English
Weight: 626 KB
Volume: 413-414
Category: Article
ISSN: 0921-5093
DOI: 10.1016/j.msea.2005.08.185

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## Abstract The Sn‐Zn alloys have been considered as lead‐free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and micro‐creep of the Sn‐9Zn lead‐free solders were investigated. It is shown that the a