## Abstract The Sn‐Zn alloys have been considered as lead‐free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and micro‐creep of the Sn‐9Zn lead‐free solders were investigated. It is shown that the a
Enhancement of solder properties of Sn-9Zn lead-free solder alloy
✍ Scribed by M. Kamal; E. S. Gouda
- Publisher
- John Wiley and Sons
- Year
- 2006
- Tongue
- English
- Weight
- 111 KB
- Volume
- 41
- Category
- Article
- ISSN
- 0232-1300
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