ChemInform Abstract: Tensile Properties and Microstructural Characterization of Sn—0.7Cu—0.4Co Bulk Solder Alloy for Electronics Applications

✍ Scribed by Cristina Andersson; Peng Sun; Johan Liu

• Publisher: John Wiley and Sons
• Year: 2008
• Weight: 15 KB
• Volume: 39
• Category: Article
• ISSN: 0931-7597
• DOI: 10.1002/chin.200831225

✦ Synopsis

Abstract

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