Microstructure and adhesion strength of Sn–9Zn–xAg lead-free solders wetted on Cu substrate

✍ Scribed by Tao-Chih Chang; Shih-Min Chou; Min-Hsiung Hon; Moo-Chin Wang

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 760 KB
• Volume: 429
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2006.04.093