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A comparison of impression, indentation and impression-relaxation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders at room temperature

✍ Scribed by R. Mahmudi; A. R. Geranmayeh; H. Noori; H. Khanbareh; N. Jahangiri

Publisher: Springer US
Year: 2008
Tongue: English
Weight: 527 KB
Volume: 20
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-008-9726-x

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## Abstract The influence of cooling rate on the creep behavior of cast Sn–(1–5)%Bi solder alloys was studied by indentation testing at room temperature. The alloys were prepared at two different cooling rates of 0.01 Ks^–1^ and 8 Ks^–1^. This affected the microstructure and thus, the creep behavio