๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

โœ Scribed by Chaosuan Kanchanomai; Yukio Miyashita; Yoshiharu Mutoh


Publisher
Springer US
Year
2002
Tongue
English
Weight
935 KB
Volume
31
Category
Article
ISSN
0361-5235

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Thermal Oxidation Study on Lead-free Sol
โœ S. Wanโ€‰Cho; K. Han; Y. Yi; S.โ€‰J. Kang; K.-H. Yoo; K. Jeong; C.-N. Whang ๐Ÿ“‚ Article ๐Ÿ“… 2006 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 188 KB

At present, the electronic packaging industry is actively searching for leadโ€free (Pbโ€free) solders due to environmental concerns over Pbโ€containing solders. For a successful transition to Pbโ€free manufacturing in electronics assembly, it is critical to understand the behavior of Pbโ€free solders. We

Creep Behavior of Lead-Free Sn-Ag-Cu
โœ N. Hidaka; H. Watanabe; M. Yoshiba ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Springer US ๐ŸŒ English โš– 826 KB